Technical and Financial Sponsorship of conferences
Technical sponsorship
TECHNICAL CO-SPONSORSHIP: Technical co-sponsorship indicates direct and substantial involvement by the Technical Co-Sponsor solely in the organization of the technical program portion of the Conference.
FINANCIAL LIABILITY: It is understood that financial liability for the Conference is the sole responsibility and obligation of the Financial Sponsoring Party. The Technical Co-Sponsor will not share in the surplus of the Conference or be expected to contribute to the financial loss, if any.
Involves:
- Publications in IEEE Trans Mag (details below)
- Supervision of technical program by at least one senior member of IEEE Magnetic Society
- Advertisement of the conference on IEEE websites
- Sending conference Call for Papers to IEEE mail lists
Note: from Jan 2016 the following financial charges apply to all technically sponsored conferences (TSC):
- A portion of the cost of TSC is allocated to the IEEE Organizational Unit (OU), i.e. Society, Council, Section, Chapter, etc., that technically Co-Sponsors the TSC and benefits from that Co-Sponsorship $1,000 plus $15 / paper sent to Xplore®
- If multiple sponsoring OUs, charge is divided equally
- Covers ~2/3 of the actual cost to IEEE. Remaining 1/3 is distributed to IEEE OUs via overhead. Currently, 100% of costs are distributed to the IEEE OUs via overhead.
Financial Sponsorship
Financial Sponsorship represents:
- insurance against financial risk,
- reduced cost to publish in IEEE Transactions on Magnetics (=1 page per article discount on publication costs)
- ability to publicize using Magnetics Society mailing lists.
Procedures for any type of sponsorship (i.e. both technical and financial)
You have to start from the application form:
http://www.ieee.org/conferences_events/conferences/organizers/conf_app.html
The sponsorship will be sanctioned by the signature of a Memorandum of Understanding (MOU). The MOU can be drafted through the IEEE ICX website:
http://www.ieee.org/conferences_events/conferences/organizers/memorandum_of_understanding.html
Tutorials (bottom of page):
http://www.ieee.org/conferences_events/conferences/organizers/conference_organizer_education.html
Enquiries concerning Technical and Financial Sponsorship of conferences should be directed to the Conference Executive Committee Chair using the contact form here: Conference Executive Committee Chair